This article is rated Start-class on Wikipedia's
content assessment scale. It is of interest to the following WikiProjects: | |||||||||||
|
Some central processing units (CPU) have an Integrated Heat Spreader (IHS) mounted on the die to protect it from damage and help spread the heat.
The die is mounted on a substrate? -- Frap 19:08, 3 November 2006 (UTC)
http://www.sweclockers.com/imagebank/30fa3/Ul5W8s.jpg
The word substrate is often used in connection with silicon chips to mean the bulk silicon wafer upon which a thin Epitaxial layer is grown. The circuit of the die is formed in the epitaxial layer and can't be separated from the bulk silicon substrate.
Silicon wafers need to be thick enough to support their own weight during processing, but can be thinned by backgrinding most of the substrate away, before separation into individual dice.
Individual dice are fragile and need some kind of substrate to support them. This is the kind of substrate shown in the picture. It's probably a PCB which supports the thin silicon die and provides external connections and easier handling. Pavium ( talk) 06:13, 28 April 2009 (UTC)
What ist the correct plural form of die: dies or dice? --
134.155.99.41 23:54, 1 December 2006 (UTC)
In the article it is written: "There are three commonly used plural forms: dice, dies, and die." But which one is the most common one? -- 134.155.99.41 19:35, 10 April 2007 (UTC)
would be nice — Preceding unsigned comment added by 77.3.182.233 ( talk) 19:53, 1 June 2011 (UTC)
The following Wikimedia Commons file used on this page has been nominated for deletion:
Participate in the deletion discussion at the nomination page. — Community Tech bot ( talk) 01:06, 28 April 2019 (UTC)
The following Wikimedia Commons file used on this page or its Wikidata item has been nominated for speedy deletion:
You can see the reason for deletion at the file description page linked above. — Community Tech bot ( talk) 11:07, 12 April 2020 (UTC)
The following Wikimedia Commons file used on this page or its Wikidata item has been nominated for deletion:
Participate in the deletion discussion at the nomination page. — Community Tech bot ( talk) 09:37, 13 April 2020 (UTC)
This article is rated Start-class on Wikipedia's
content assessment scale. It is of interest to the following WikiProjects: | |||||||||||
|
Some central processing units (CPU) have an Integrated Heat Spreader (IHS) mounted on the die to protect it from damage and help spread the heat.
The die is mounted on a substrate? -- Frap 19:08, 3 November 2006 (UTC)
http://www.sweclockers.com/imagebank/30fa3/Ul5W8s.jpg
The word substrate is often used in connection with silicon chips to mean the bulk silicon wafer upon which a thin Epitaxial layer is grown. The circuit of the die is formed in the epitaxial layer and can't be separated from the bulk silicon substrate.
Silicon wafers need to be thick enough to support their own weight during processing, but can be thinned by backgrinding most of the substrate away, before separation into individual dice.
Individual dice are fragile and need some kind of substrate to support them. This is the kind of substrate shown in the picture. It's probably a PCB which supports the thin silicon die and provides external connections and easier handling. Pavium ( talk) 06:13, 28 April 2009 (UTC)
What ist the correct plural form of die: dies or dice? --
134.155.99.41 23:54, 1 December 2006 (UTC)
In the article it is written: "There are three commonly used plural forms: dice, dies, and die." But which one is the most common one? -- 134.155.99.41 19:35, 10 April 2007 (UTC)
would be nice — Preceding unsigned comment added by 77.3.182.233 ( talk) 19:53, 1 June 2011 (UTC)
The following Wikimedia Commons file used on this page has been nominated for deletion:
Participate in the deletion discussion at the nomination page. — Community Tech bot ( talk) 01:06, 28 April 2019 (UTC)
The following Wikimedia Commons file used on this page or its Wikidata item has been nominated for speedy deletion:
You can see the reason for deletion at the file description page linked above. — Community Tech bot ( talk) 11:07, 12 April 2020 (UTC)
The following Wikimedia Commons file used on this page or its Wikidata item has been nominated for deletion:
Participate in the deletion discussion at the nomination page. — Community Tech bot ( talk) 09:37, 13 April 2020 (UTC)