Home
•
Search
•
Translate
From Wikipedia, the free encyclopedia
<
Template:POTD
Picture of the day archives
:
2023 February
<
2023 February 12
2023 February 14
>
Picture of the day
Wire bonding
is the method of making interconnections between an
integrated circuit
or other
semiconductor device
and its
packaging
during
semiconductor device fabrication
. This
macro photograph
depicts a integrated circuit that functions as an
intermediate-frequency amplifier
and
demodulator
in a
transceiver
, with gold wire
ball-bonded
on a silicon
die
.
Photograph credit:
Mister rf
Archive
–
More featured pictures...
Category
:
Wikipedia Picture of the day February 2023
From Wikipedia, the free encyclopedia
<
Template:POTD
Picture of the day archives
:
2023 February
<
2023 February 12
2023 February 14
>
Picture of the day
Wire bonding
is the method of making interconnections between an
integrated circuit
or other
semiconductor device
and its
packaging
during
semiconductor device fabrication
. This
macro photograph
depicts a integrated circuit that functions as an
intermediate-frequency amplifier
and
demodulator
in a
transceiver
, with gold wire
ball-bonded
on a silicon
die
.
Photograph credit:
Mister rf
Archive
–
More featured pictures...
Category
:
Wikipedia Picture of the day February 2023
Videos
Youtube
|
Vimeo
|
Bing
Websites
Google
|
Yahoo
|
Bing
Encyclopedia
Google
|
Yahoo
|
Bing
Facebook
Top Of Page
Home
•
Search
•
Translate
©
CSE