From Wikipedia, the free encyclopedia
Model
( Code name)
Release date
& price
Architecture
fab
Transistors
& die size
Core Fillrate [a] [b] [c] Processing power [a] [d]
( GFLOPS)
Memory TBP Bus interface
Config [e] Clock [a]
( MHz)
Texture
( GT/s)
Pixel
( GP/s)
Single Double Size
( GB)
Bandwidth
( GB/s)
Bus type
& width
Clock
( MT/s)
Radeon 610
(Banks) [1]
Aug 13, 2019
OEM [2]
GCN 1 [3]
TSMC  28 nm
6.9×108
56 mm2
320:20:4
5 CU

1030

20.60

8.24

659.2

41.20
2
4
36.0 GDDR5
64-bit
4500 50 W PCIe 3.0 ×8
Radeon 620
(Polaris 24) [4]
GCN 3 [5]
TSMC 28 nm
1.55×109
125 mm2
320:20:8
6 CU
730
1024
17.52
24.58
5.84
8.19
560.6
786.4
35.04
49.15
14.4 DDR3
64-bit
1800
384:24:8
6 CU
36.0 GDDR5
64-bit
4500
Radeon 625
(Polaris 24) [6]
Radeon 630
(Polaris 23) [7] [8]
GCN 4
GloFo  14 nm [f]
2.2×109
103 mm2
512:32:8
8 CU
1082
1219
34.62
38.98
8.65
9.75
1,108
1,248
69.24
78.01
48.0 6000
Radeon RX 640
(Polaris 23) [10] [11]
512:40:16
8 CU
1082
1287
43.28
51.48
17.31
20.59
1,385
1,647
86.56
102.9
56.0 7000
640:40:16
10 CU
  1. ^ a b c Boost values (if available) are stated below the base value in italic.
  2. ^ Texture fillrate is calculated as the number of Texture Mapping Units multiplied by the base (or boost) core clock speed.
  3. ^ Pixel fillrate is calculated as the number of Render Output Units multiplied by the base (or boost) core clock speed.
  4. ^ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  5. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  6. ^ GlobalFoundries' 14 nm 14LPP FinFET process is second-sourced from Samsung Electronics. [9]
From Wikipedia, the free encyclopedia
Model
( Code name)
Release date
& price
Architecture
fab
Transistors
& die size
Core Fillrate [a] [b] [c] Processing power [a] [d]
( GFLOPS)
Memory TBP Bus interface
Config [e] Clock [a]
( MHz)
Texture
( GT/s)
Pixel
( GP/s)
Single Double Size
( GB)
Bandwidth
( GB/s)
Bus type
& width
Clock
( MT/s)
Radeon 610
(Banks) [1]
Aug 13, 2019
OEM [2]
GCN 1 [3]
TSMC  28 nm
6.9×108
56 mm2
320:20:4
5 CU

1030

20.60

8.24

659.2

41.20
2
4
36.0 GDDR5
64-bit
4500 50 W PCIe 3.0 ×8
Radeon 620
(Polaris 24) [4]
GCN 3 [5]
TSMC 28 nm
1.55×109
125 mm2
320:20:8
6 CU
730
1024
17.52
24.58
5.84
8.19
560.6
786.4
35.04
49.15
14.4 DDR3
64-bit
1800
384:24:8
6 CU
36.0 GDDR5
64-bit
4500
Radeon 625
(Polaris 24) [6]
Radeon 630
(Polaris 23) [7] [8]
GCN 4
GloFo  14 nm [f]
2.2×109
103 mm2
512:32:8
8 CU
1082
1219
34.62
38.98
8.65
9.75
1,108
1,248
69.24
78.01
48.0 6000
Radeon RX 640
(Polaris 23) [10] [11]
512:40:16
8 CU
1082
1287
43.28
51.48
17.31
20.59
1,385
1,647
86.56
102.9
56.0 7000
640:40:16
10 CU
  1. ^ a b c Boost values (if available) are stated below the base value in italic.
  2. ^ Texture fillrate is calculated as the number of Texture Mapping Units multiplied by the base (or boost) core clock speed.
  3. ^ Pixel fillrate is calculated as the number of Render Output Units multiplied by the base (or boost) core clock speed.
  4. ^ Precision performance is calculated from the base (or boost) core clock speed based on a FMA operation.
  5. ^ Unified shaders : Texture mapping units : Render output units and Compute units (CU)
  6. ^ GlobalFoundries' 14 nm 14LPP FinFET process is second-sourced from Samsung Electronics. [9]

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