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Does Wafer level mean the bonding takes place before the wafer dicing? Bonding the die makes more sense to me. User:ScotXW ^t@lk 10:54, 10 June 2014 (UTC) reply

There is a growing technology of wafer-to-wafer bonding to construct integrated devices in three dimensions. See [1] for instance. However, I agree that this article is unclear on what its subject actually is and wanders off into MEMS packaging. I would say that "die bonding" is a subset of "wafer bonding". As for before or after dicing, I don't think that is particularly relevant, although the thicker you make the compound wafers the harder it is going to be to dice succesfully so for large chips dicing first might be a good option. Spinning Spark 11:44, 10 June 2014 (UTC) reply