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In the Overview section, the following sentence:

"Compared to glass frit bonding, the advantage sticks out that the reduction of seal ring geometries, an increase of the hermeticity levels and a shrinking of device size is possible."

doesn't make sense. Especially confusing is the phrase, "the advantage sticks out that the reduction of seal ring geometries,"

I think that the shown Au-Si phase diagram isn't correct. In this diagram the eutectic temperature is 636°C, but in the text the eutectic temperature is mentioned to be 370°C. 87.173.93.167 ( talk) 19:33, 8 September 2015 (UTC) reply