 | |
Native name | 株式会社ディスコ |
|---|---|
| Company type | Public KK |
| TYO: 6146 | |
| ISIN | JP3548600000 |
| Industry | Semiconductor |
| Founded | May 5, 1937 in Kure city, Hiroshima as Dai-Ichi Seitosho Company |
| Founder | Mitsuo Sekiya |
| Headquarters |
Omori-Kita,
Ōta, Tokyo 162-8557 , Japan |
Area served | Worldwide |
Key people | Hitoshi Mizorogi ( Chairman of the Board) Kazuma Sekiya ( President and CEO) |
| Products |
|
| Revenue | 
JPY ¥253.78 billion( US$ 2.21 billion) ( FY 2021) |
| JPY ¥66.21 billion (US$ 576 million) (FY 2021) | |
Number of employees | 4,091 (as of March 31, 2021) |
| Website | Official website |
| Footnotes / references [1] [2] | |
DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. [2]
History
The company was founded as Daiichi-Seitosho in May 1937, as an industrial abrasive wheel manufacturer. [3]
After World War II Japan faced a construction boom which also helped DISCO to boost its sales. The company's grinder discs were in high demand from utility companies, which needed them to manufacture watt-meters. [4]
In December 1968 the company developed and released an ultra-thin resinoid cutting wheel, Microncut. The wheel contained diamond powder and as a result it was capable of making sharp, precision cuts as demanded in the semiconductor manufacturing process. There were no cutting machines available in the market on which ultra-thin precision wheels could be mounted and run, DISCO decided to develop its own machine in 1975. The cutting machine, DAD-2h, received instant recognition from semiconductor companies, including Texas Instruments. [3]
The company adopted the name of DISCO Corporation in May 1977, [3] was listed with the Japan Securities Dealers' Association in October 1989, and entered the First Section of the Tokyo Stock Exchange in December 1999.[ citation needed]
References
- ^ "Corporate Outline". DISCO Corporation. Retrieved September 23, 2017.
- ^ a b "Company Profile". Nikkei Asian Review. Nikkei Inc. Retrieved September 23, 2017.
- ^ a b c Ishikawa, Akira; Nej, Tai (2004). Top Global Companies in Japan. World Scientific. pp. 64–67. ISBN 978-981-238-684-7.
- ^ Nakayama, Wataru; Boulton, William; Pecht (June 25, 1999). The Japanese Electronics Industry. CRC Press. p. 38. ISBN 978-1-58488-026-4.
External links
- Disco Corporation global website (in English)
- European Website (in English)
|
| |
Native name | 株式会社ディスコ |
|---|---|
| Company type | Public KK |
| TYO: 6146 | |
| ISIN | JP3548600000 |
| Industry | Semiconductor |
| Founded | May 5, 1937 in Kure city, Hiroshima as Dai-Ichi Seitosho Company |
| Founder | Mitsuo Sekiya |
| Headquarters |
Omori-Kita,
Ōta, Tokyo 162-8557 , Japan |
Area served | Worldwide |
Key people | Hitoshi Mizorogi ( Chairman of the Board) Kazuma Sekiya ( President and CEO) |
| Products |
|
| Revenue |
JPY ¥253.78 billion ( US$ 2.21 billion) ( FY 2021) |
| JPY ¥66.21 billion (US$ 576 million) (FY 2021) | |
Number of employees | 4,091 (as of March 31, 2021) |
| Website | Official website |
| Footnotes / references [1] [2] | |
DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength. [2]
History
The company was founded as Daiichi-Seitosho in May 1937, as an industrial abrasive wheel manufacturer. [3]
After World War II Japan faced a construction boom which also helped DISCO to boost its sales. The company's grinder discs were in high demand from utility companies, which needed them to manufacture watt-meters. [4]
In December 1968 the company developed and released an ultra-thin resinoid cutting wheel, Microncut. The wheel contained diamond powder and as a result it was capable of making sharp, precision cuts as demanded in the semiconductor manufacturing process. There were no cutting machines available in the market on which ultra-thin precision wheels could be mounted and run, DISCO decided to develop its own machine in 1975. The cutting machine, DAD-2h, received instant recognition from semiconductor companies, including Texas Instruments. [3]
The company adopted the name of DISCO Corporation in May 1977, [3] was listed with the Japan Securities Dealers' Association in October 1989, and entered the First Section of the Tokyo Stock Exchange in December 1999.[ citation needed]
References
- ^ "Corporate Outline". DISCO Corporation. Retrieved September 23, 2017.
- ^ a b "Company Profile". Nikkei Asian Review. Nikkei Inc. Retrieved September 23, 2017.
- ^ a b c Ishikawa, Akira; Nej, Tai (2004). Top Global Companies in Japan. World Scientific. pp. 64–67. ISBN 978-981-238-684-7.
- ^ Nakayama, Wataru; Boulton, William; Pecht (June 25, 1999). The Japanese Electronics Industry. CRC Press. p. 38. ISBN 978-1-58488-026-4.
External links
- Disco Corporation global website (in English)
- European Website (in English)