Beth Keser is an American electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and president of the International Microelectronics and Packaging Society.
Keser is originally from Rochester, New York; although her parents were working class, many of her childhood friends were children of engineers. [1] [2] She focused on materials science [2] as an undergraduate at Cornell University, graduating in 1993, [3] and earned a Ph.D. in 1997 from the University of Illinois Urbana-Champaign. [3]
After postdoctoral work in a research and development laboratory, [1] she worked on advanced electronic packaging at Motorola for twelve years. [4] In 2009, [3] she became the leader of the Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group for Qualcomm, [4] before moving to her present position at Intel. [1]
She was elected as president of the International Microelectronics and Packaging Society for the 2022–2023 term. [5]
Keser is a Distinguished Lecturer for the IEEE Electronics Packaging Society for 2020–2024. [6] She was named an IEEE Fellow, in the 2020 class of fellows, "for contributions to electronic packaging technologies". [7] In 2021, she received the Exceptional Technical Achievement Award of the IEEE Electronics Packaging Society, with Tanja Braun, "for seminal contributions and leadership in Fan-out Wafer Level Packaging". [8]
She was also one of five winners in a 2015 scriptwriting competition seeking pitches for a television show about a woman engineer, the only engineer to win. [3]
Beth Keser is an American electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and president of the International Microelectronics and Packaging Society.
Keser is originally from Rochester, New York; although her parents were working class, many of her childhood friends were children of engineers. [1] [2] She focused on materials science [2] as an undergraduate at Cornell University, graduating in 1993, [3] and earned a Ph.D. in 1997 from the University of Illinois Urbana-Champaign. [3]
After postdoctoral work in a research and development laboratory, [1] she worked on advanced electronic packaging at Motorola for twelve years. [4] In 2009, [3] she became the leader of the Fan-Out and Fan-In Wafer Level Packaging Technology Development and NPI Group for Qualcomm, [4] before moving to her present position at Intel. [1]
She was elected as president of the International Microelectronics and Packaging Society for the 2022–2023 term. [5]
Keser is a Distinguished Lecturer for the IEEE Electronics Packaging Society for 2020–2024. [6] She was named an IEEE Fellow, in the 2020 class of fellows, "for contributions to electronic packaging technologies". [7] In 2021, she received the Exceptional Technical Achievement Award of the IEEE Electronics Packaging Society, with Tanja Braun, "for seminal contributions and leadership in Fan-out Wafer Level Packaging". [8]
She was also one of five winners in a 2015 scriptwriting competition seeking pitches for a television show about a woman engineer, the only engineer to win. [3]